APA (7th ed.) Citation

Wu, W. H., Chung, H. L., & Chen, B. Z. (2010). Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints. Journal of Electronic Materials, 39(12), 2653. https://doi.org/10.1007/s11664-010-1299-9

Chicago Style (17th ed.) Citation

Wu, W. H., H. L. Chung, and B. Z. Chen. "Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints." Journal of Electronic Materials 39, no. 12 (2010): 2653. https://doi.org/10.1007/s11664-010-1299-9.

MLA (9th ed.) Citation

Wu, W. H., et al. "Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints." Journal of Electronic Materials, vol. 39, no. 12, 2010, p. 2653, https://doi.org/10.1007/s11664-010-1299-9.