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Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints.

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Title: Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints.
Authors: Wu, W. H., Chung, H. L., Chen, B. Z.
Source: Journal of Electronic Materials; December 2010, Vol. 39 Issue 12, p2653-2661, 9p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501714912
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; December 2010, Vol. 39 Issue 12, p2653-2661, 9p
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        Value: 10.1007/s11664-010-1299-9
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      – Code: eng
        Text: English
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        PageCount: 9
        StartPage: 2653
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      – TitleFull: Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints.
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            NameFull: Wu, W. H.
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            NameFull: Chung, H. L.
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            NameFull: Chen, B. Z.
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              Text: December 2010
              Type: published
              Y: 2010
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