Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints.
Saved in:
| Title: | Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints. |
|---|---|
| Authors: | Wu, W. H., Chung, H. L., Chen, B. Z. |
| Source: | Journal of Electronic Materials; December 2010, Vol. 39 Issue 12, p2653-2661, 9p |
| Database: | Applied Science & Technology Source |
Be the first to leave a comment!
