Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer.

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Bibliographic Details
Title:	Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer.
Authors:	Chang, C. C., Chung, H. Y., Lai, Y. S.
Source:	Journal of Electronic Materials; December 2010, Vol. 39 Issue 12, p2662-2668, 7p
Database:	Applied Science & Technology Source

Description
ISSN:	03615235
DOI:	10.1007/s11664-010-1272-7