APA (7th ed.) Citation

Chang, C. C., Chung, H. Y., & Lai, Y. S. (2010). Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer. Journal of Electronic Materials, 39(12), 2662. https://doi.org/10.1007/s11664-010-1272-7

Chicago Style (17th ed.) Citation

Chang, C. C., H. Y. Chung, and Y. S. Lai. "Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer." Journal of Electronic Materials 39, no. 12 (2010): 2662. https://doi.org/10.1007/s11664-010-1272-7.

MLA (9th ed.) Citation

Chang, C. C., et al. "Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer." Journal of Electronic Materials, vol. 39, no. 12, 2010, p. 2662, https://doi.org/10.1007/s11664-010-1272-7.