Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer.
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| Title: | Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer. |
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| Authors: | Chang, C. C., Chung, H. Y., Lai, Y. S. |
| Source: | Journal of Electronic Materials; December 2010, Vol. 39 Issue 12, p2662-2668, 7p |
| Database: | Applied Science & Technology Source |
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