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Numerical analysis of thermal stability of an immersion-cooled, pancake type superconducting coil.

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Bibliographic Details
Title:	Numerical analysis of thermal stability of an immersion-cooled, pancake type superconducting coil.
Authors:	Okada, S., Kim, J.-K., Aihara, T.
Source:	Cryogenics; July 1991, Vol. 31, p547-550, 4p
Database:	Applied Science & Technology Source

Description
ISSN:	00112275
DOI:	10.1016/0011-2275(91)90045-X