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Numerical analysis of thermal stability of an immersion-cooled, pancake type superconducting coil.

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Bibliographic Details
Title: Numerical analysis of thermal stability of an immersion-cooled, pancake type superconducting coil.
Authors: Okada, S., Kim, J.-K., Aihara, T.
Source: Cryogenics; July 1991, Vol. 31, p547-550, 4p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501897230
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Numerical analysis of thermal stability of an immersion-cooled, pancake type superconducting coil.
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  Data: <searchLink fieldCode="JN" term="%22Cryogenics%22">Cryogenics</searchLink>; July 1991, Vol. 31, p547-550, 4p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501897230
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/0011-2275(91)90045-X
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 4
        StartPage: 547
    Titles:
      – TitleFull: Numerical analysis of thermal stability of an immersion-cooled, pancake type superconducting coil.
        Type: main
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      – PersonEntity:
          Name:
            NameFull: Okada, S.
      – PersonEntity:
          Name:
            NameFull: Kim, J.-K.
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            NameFull: Aihara, T.
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          Dates:
            – D: 01
              M: 07
              Text: July 1991
              Type: published
              Y: 1991
          Identifiers:
            – Type: issn-print
              Value: 00112275
          Numbering:
            – Type: volume
              Value: 31
          Titles:
            – TitleFull: Cryogenics
              Type: main
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