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Numerical analysis of thermal stability of an immersion-cooled, pancake type superconducting coil.

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Bibliographic Details
Title: Numerical analysis of thermal stability of an immersion-cooled, pancake type superconducting coil.
Authors: Okada, S., Kim, J.-K., Aihara, T.
Source: Cryogenics; July 1991, Vol. 31, p547-550, 4p
Database: Applied Science & Technology Source
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