Prediction of cure induced warpage of micro-electronic products

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Bibliographic Details
Title: Prediction of cure induced warpage of micro-electronic products
Authors: de Vreugd, J.1, j.devreugd@tudelft.nl, Jansen, K.M.B.1, Ernst, L.J.1, Bohm, C.2
Source: Microelectronics Reliability; Jul2010, Vol. 50 Issue 7, p910-916, 7p
Database: Applied Science & Technology Source
Description
ISSN:00262714
DOI:10.1016/j.microrel.2010.02.028