Prediction of cure induced warpage of micro-electronic products
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| Title: | Prediction of cure induced warpage of micro-electronic products |
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| Authors: | de Vreugd, J.1, j.devreugd@tudelft.nl, Jansen, K.M.B.1, Ernst, L.J.1, Bohm, C.2 |
| Source: | Microelectronics Reliability; Jul2010, Vol. 50 Issue 7, p910-916, 7p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00262714 |
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| DOI: | 10.1016/j.microrel.2010.02.028 |