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Barrier/bonding layers on bismuth telluride (BiTe) for high temperature thermoelectric modules.

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Title: Barrier/bonding layers on bismuth telluride (BiTe) for high temperature thermoelectric modules.
Authors: Lin, Wen P.1, michellelin.tw@gmail.com, Wesolowski, Daniel E.2, dewesol@sandia.gov, Lee, Chin C.1
Source: Journal of Materials Science: Materials in Electronics; Sep2011, Vol. 22 Issue 9, p1313-1320, 8p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 63994997
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PubType: Academic Journal
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  Data: Barrier/bonding layers on bismuth telluride (BiTe) for high temperature thermoelectric modules.
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  Data: <searchLink fieldCode="AU" term="%22Lin%2C+Wen+P%2E%22">Lin, Wen P.</searchLink><relatesTo>1</relatesTo>, <i>michellelin.tw@gmail.com</i><br /><searchLink fieldCode="AU" term="%22Wesolowski%2C+Daniel+E%2E%22">Wesolowski, Daniel E.</searchLink><relatesTo>2</relatesTo>, <i>dewesol@sandia.gov</i><br /><searchLink fieldCode="AU" term="%22Lee%2C+Chin+C%2E%22">Lee, Chin C.</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Sep2011, Vol. 22 Issue 9, p1313-1320, 8p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=63994997
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      – Type: doi
        Value: 10.1007/s10854-011-0306-0
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      – Code: eng
        Text: English
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        PageCount: 8
        StartPage: 1313
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      – TitleFull: Barrier/bonding layers on bismuth telluride (BiTe) for high temperature thermoelectric modules.
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            NameFull: Lin, Wen P.
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            NameFull: Wesolowski, Daniel E.
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            NameFull: Lee, Chin C.
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            – D: 01
              M: 09
              Text: Sep2011
              Type: published
              Y: 2011
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              Value: 22
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              Value: 9
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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