Effect of Pd thickness on wettability and interfacial reaction of Sn-1.0Ag-Ce solders on ENEPIG surface finish.
Saved in:
| Title: | Effect of Pd thickness on wettability and interfacial reaction of Sn-1.0Ag-Ce solders on ENEPIG surface finish. |
|---|---|
| Authors: | Bui, Q.1, Jung, S.1, sbjung@skku.edu |
| Source: | Journal of Materials Science: Materials in Electronics; Jan2014, Vol. 25 Issue 1, p423-430, 8p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09574522 |
|---|---|
| DOI: | 10.1007/s10854-013-1605-4 |