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Robust Co alloy design for Co interconnects using a self-forming barrier layer.

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Title: Robust Co alloy design for Co interconnects using a self-forming barrier layer.
Authors: Kim, Cheol1 (AUTHOR), Kang, Geosan1 (AUTHOR), Jung, Youngran1 (AUTHOR), Kim, Ji-Yong1 (AUTHOR), Lee, Gi-Baek1 (AUTHOR), Hong, Deokgi1 (AUTHOR), Lee, Yoongu1 (AUTHOR), Hwang, Soon-Gyu1 (AUTHOR), Jung, In-Ho1 (AUTHOR), Joo, Young-Chang1,2 (AUTHOR) ycjoo@snu.ac.kr
Source: Scientific Reports. 7/19/2022, Vol. 12 Issue 1, p1-9. 9p.
Database: Academic Search Ultimate
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ISSN:20452322
DOI:10.1038/s41598-022-16288-y