APA (7th ed.) Citation

Kim, C., Kang, G., Jung, Y., Kim, J., Lee, G., Hong, D., . . . Joo, Y. (2022). Robust Co alloy design for Co interconnects using a self-forming barrier layer. Scientific Reports, 12(1), 1. https://doi.org/10.1038/s41598-022-16288-y

Chicago Style (17th ed.) Citation

Kim, Cheol, et al. "Robust Co Alloy Design for Co Interconnects Using a Self-forming Barrier Layer." Scientific Reports 12, no. 1 (2022): 1. https://doi.org/10.1038/s41598-022-16288-y.

MLA (9th ed.) Citation

Kim, Cheol, et al. "Robust Co Alloy Design for Co Interconnects Using a Self-forming Barrier Layer." Scientific Reports, vol. 12, no. 1, 2022, p. 1, https://doi.org/10.1038/s41598-022-16288-y.