Self‐assembly Mechanism and Chiral Transfer in CuO Superstructures.

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Title: Self‐assembly Mechanism and Chiral Transfer in CuO Superstructures.
Authors: Zhang, Jun1,2,3,4 (AUTHOR) junzhang.chem@outlook.com, Vallée, Renaud A. L.5 (AUTHOR) renaud.vallee@u-bordeaux.fr, Kochovski, Zdravko6 (AUTHOR), Zhang, Wei3 (AUTHOR), Shen, Chen4 (AUTHOR), Bertram, Florian4 (AUTHOR), Pinna, Nicola3 (AUTHOR) nicola.pinna@hu-berlin.de
Source: Angewandte Chemie. 7/3/2023, Vol. 135 Issue 27, p1-9. 9p.
Database: Academic Search Ultimate
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ISSN:00448249
DOI:10.1002/ange.202305353