Heat transfer enhancement of electronic devices by using flexible printed circuit boards.

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Bibliographic Details
Title: Heat transfer enhancement of electronic devices by using flexible printed circuit boards.
Authors: EMAD, Mustafa1, ALJABAIR, Sattar1 Sattar.J.Aljabair@uotechnology.edu.iq, IMRAN, Ahmed Abdulnabi1
Source: Journal of Thermal Engineering. Nov2023, Vol. 9 Issue 6, p1531-1547. 17p.
Database: Academic Search Ultimate
Description
ISSN:21487847
DOI:10.18186/thermal.1401009