Heat transfer enhancement of electronic devices by using flexible printed circuit boards.
Saved in:
| Title: | Heat transfer enhancement of electronic devices by using flexible printed circuit boards. |
|---|---|
| Authors: | EMAD, Mustafa1, ALJABAIR, Sattar1 Sattar.J.Aljabair@uotechnology.edu.iq, IMRAN, Ahmed Abdulnabi1 |
| Source: | Journal of Thermal Engineering. Nov2023, Vol. 9 Issue 6, p1531-1547. 17p. |
| Database: | Academic Search Ultimate |
| ISSN: | 21487847 |
|---|---|
| DOI: | 10.18186/thermal.1401009 |