APA (7th ed.) Citation

EMAD, M., ALJABAIR, S., & IMRAN, A. A. (2023). Heat transfer enhancement of electronic devices by using flexible printed circuit boards. Journal of Thermal Engineering, 9(6), 1531. https://doi.org/10.18186/thermal.1401009

Chicago Style (17th ed.) Citation

EMAD, Mustafa, Sattar ALJABAIR, and Ahmed Abdulnabi IMRAN. "Heat Transfer Enhancement of Electronic Devices by Using Flexible Printed Circuit Boards." Journal of Thermal Engineering 9, no. 6 (2023): 1531. https://doi.org/10.18186/thermal.1401009.

MLA (9th ed.) Citation

EMAD, Mustafa, et al. "Heat Transfer Enhancement of Electronic Devices by Using Flexible Printed Circuit Boards." Journal of Thermal Engineering, vol. 9, no. 6, 2023, p. 1531, https://doi.org/10.18186/thermal.1401009.