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Heat transfer enhancement of electronic devices by using flexible printed circuit boards.

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Title: Heat transfer enhancement of electronic devices by using flexible printed circuit boards.
Authors: EMAD, Mustafa1, ALJABAIR, Sattar1 Sattar.J.Aljabair@uotechnology.edu.iq, IMRAN, Ahmed Abdulnabi1
Source: Journal of Thermal Engineering. Nov2023, Vol. 9 Issue 6, p1531-1547. 17p.
Database: Academic Search Ultimate
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  Data: Heat transfer enhancement of electronic devices by using flexible printed circuit boards.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Thermal+Engineering%22">Journal of Thermal Engineering</searchLink>. Nov2023, Vol. 9 Issue 6, p1531-1547. 17p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=174224361
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      – Type: doi
        Value: 10.18186/thermal.1401009
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      – Code: eng
        Text: English
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        PageCount: 17
        StartPage: 1531
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      – TitleFull: Heat transfer enhancement of electronic devices by using flexible printed circuit boards.
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            NameFull: EMAD, Mustafa
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            NameFull: ALJABAIR, Sattar
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            NameFull: IMRAN, Ahmed Abdulnabi
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            – D: 01
              M: 11
              Text: Nov2023
              Type: published
              Y: 2023
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              Value: 9
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              Value: 6
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            – TitleFull: Journal of Thermal Engineering
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