Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB).
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| Title: | Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB). |
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| Authors: | Han, Sang-Eun1,2 (AUTHOR), Choi, Dong-Gyu1,2,3 (AUTHOR), Han, Seonghui1,3,4 (AUTHOR), Lee, Tae-Young4,5 (AUTHOR) lty1226@tukorea.ac.kr, Han, Deok-Gon5,6 (AUTHOR), Lee, Hoo-Jeong2,6 (AUTHOR), Yoo, Sehoon1 (AUTHOR) yoos@kitech.re.kr |
| Source: | Materials (1996-1944). Apr2025, Vol. 18 Issue 8, p1834. 14p. |
| Database: | Academic Search Ultimate |
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| ISSN: | 19961944 |
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| DOI: | 10.3390/ma18081834 |
