APA (7th ed.) Citation

Han, S., Choi, D., Han, S., Lee, T., Han, D., Lee, H., & Yoo, S. (2025). Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB). Materials (1996-1944), 18(8), 1834. https://doi.org/10.3390/ma18081834

Chicago Style (17th ed.) Citation

Han, Sang-Eun, Dong-Gyu Choi, Seonghui Han, Tae-Young Lee, Deok-Gon Han, Hoo-Jeong Lee, and Sehoon Yoo. "Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)." Materials (1996-1944) 18, no. 8 (2025): 1834. https://doi.org/10.3390/ma18081834.

MLA (9th ed.) Citation

Han, Sang-Eun, et al. "Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)." Materials (1996-1944), vol. 18, no. 8, 2025, p. 1834, https://doi.org/10.3390/ma18081834.