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Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB).

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Title: Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB).
Authors: Han, Sang-Eun1,2 (AUTHOR), Choi, Dong-Gyu1,2,3 (AUTHOR), Han, Seonghui1,3,4 (AUTHOR), Lee, Tae-Young4,5 (AUTHOR) lty1226@tukorea.ac.kr, Han, Deok-Gon5,6 (AUTHOR), Lee, Hoo-Jeong2,6 (AUTHOR), Yoo, Sehoon1 (AUTHOR) yoos@kitech.re.kr
Source: Materials (1996-1944). Apr2025, Vol. 18 Issue 8, p1834. 14p.
Database: Academic Search Ultimate
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An: 184752752
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  Data: Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB).
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  Data: <searchLink fieldCode="AR" term="%22Han%2C+Sang-Eun%22">Han, Sang-Eun</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Choi%2C+Dong-Gyu%22">Choi, Dong-Gyu</searchLink><relatesTo>1,2,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Han%2C+Seonghui%22">Han, Seonghui</searchLink><relatesTo>1,3,4</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Lee%2C+Tae-Young%22">Lee, Tae-Young</searchLink><relatesTo>4,5</relatesTo> (AUTHOR)<i> lty1226@tukorea.ac.kr</i><br /><searchLink fieldCode="AR" term="%22Han%2C+Deok-Gon%22">Han, Deok-Gon</searchLink><relatesTo>5,6</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Lee%2C+Hoo-Jeong%22">Lee, Hoo-Jeong</searchLink><relatesTo>2,6</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yoo%2C+Sehoon%22">Yoo, Sehoon</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yoos@kitech.re.kr</i>
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  Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Apr2025, Vol. 18 Issue 8, p1834. 14p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=184752752
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.3390/ma18081834
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      – Code: eng
        Text: English
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        PageCount: 14
        StartPage: 1834
    Titles:
      – TitleFull: Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB).
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            NameFull: Han, Sang-Eun
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            NameFull: Choi, Dong-Gyu
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            NameFull: Han, Seonghui
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            NameFull: Lee, Tae-Young
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            NameFull: Han, Deok-Gon
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            NameFull: Lee, Hoo-Jeong
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            – D: 15
              M: 04
              Text: Apr2025
              Type: published
              Y: 2025
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              Value: 18
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              Value: 8
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            – TitleFull: Materials (1996-1944)
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