Flexible three-dimensional integrated circuits (3D ICs) based on liquid metal.

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Bibliographic Details
Title:	Flexible three-dimensional integrated circuits (3D ICs) based on liquid metal.
Authors:	Tian, Ruiwen¹, Chen, Jianhui¹, Zhu, Ming², Dianpeng Qi^1,3 dpqi@hit.edu.cn, Xiaodong Chen² chenxd@ntu.edu.sg
Source:	Wearable Electronics. Dec2025, Vol. 2, p1-17. 17p.
Database:	Academic Search Ultimate

Description
ISSN:	29502357
DOI:	10.1016/j.wees.2024.12.001