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Flexible three-dimensional integrated circuits (3D ICs) based on liquid metal.

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Title: Flexible three-dimensional integrated circuits (3D ICs) based on liquid metal.
Authors: Tian, Ruiwen1, Chen, Jianhui1, Zhu, Ming2, Dianpeng Qi1,3 dpqi@hit.edu.cn, Xiaodong Chen2 chenxd@ntu.edu.sg
Source: Wearable Electronics. Dec2025, Vol. 2, p1-17. 17p.
Database: Academic Search Ultimate
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PubType: Academic Journal
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  Data: Flexible three-dimensional integrated circuits (3D ICs) based on liquid metal.
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  Data: <searchLink fieldCode="JN" term="%22Wearable+Electronics%22">Wearable Electronics</searchLink>. Dec2025, Vol. 2, p1-17. 17p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=190397367
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1016/j.wees.2024.12.001
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      – Code: eng
        Text: English
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        PageCount: 17
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            NameFull: Tian, Ruiwen
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            NameFull: Chen, Jianhui
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            NameFull: Zhu, Ming
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            NameFull: Dianpeng Qi
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              M: 12
              Text: Dec2025
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              Y: 2025
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