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Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips.

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Bibliographic Details
Title: Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips.
Authors: Zhang, Zheng1 (AUTHOR), Zhang, Yanlin1 (AUTHOR), Luo, Yuanyuan2 (AUTHOR), Lv, Guoliang1 (AUTHOR), Yin, Jianglin1 (AUTHOR), Tan, Pengwei1 (AUTHOR), Duan, Guotao1,3 (AUTHOR) duangt@hust.edu.cn
Source: Nano-Micro Letters. 1/26/2026, Vol. 18 Issue 1, p1-16. 16p.
Database: Academic Search Ultimate
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ISSN:23116706
DOI:10.1007/s40820-026-02080-4