APA (7th ed.) Citation

Zhang, Z., Zhang, Y., Luo, Y., Lv, G., Yin, J., Tan, P., & Duan, G. (2026). Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips. Nano-Micro Letters, 18(1), 1. https://doi.org/10.1007/s40820-026-02080-4

Chicago Style (17th ed.) Citation

Zhang, Zheng, Yanlin Zhang, Yuanyuan Luo, Guoliang Lv, Jianglin Yin, Pengwei Tan, and Guotao Duan. "Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips." Nano-Micro Letters 18, no. 1 (2026): 1. https://doi.org/10.1007/s40820-026-02080-4.

MLA (9th ed.) Citation

Zhang, Zheng, et al. "Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips." Nano-Micro Letters, vol. 18, no. 1, 2026, p. 1, https://doi.org/10.1007/s40820-026-02080-4.