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Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips.

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Title: Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips.
Authors: Zhang, Zheng1 (AUTHOR), Zhang, Yanlin1 (AUTHOR), Luo, Yuanyuan2 (AUTHOR), Lv, Guoliang1 (AUTHOR), Yin, Jianglin1 (AUTHOR), Tan, Pengwei1 (AUTHOR), Duan, Guotao1,3 (AUTHOR) duangt@hust.edu.cn
Source: Nano-Micro Letters. 1/26/2026, Vol. 18 Issue 1, p1-16. 16p.
Database: Academic Search Ultimate
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An: 191837257
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  Data: Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips.
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  Data: <searchLink fieldCode="JN" term="%22Nano-Micro+Letters%22">Nano-Micro Letters</searchLink>. 1/26/2026, Vol. 18 Issue 1, p1-16. 16p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=191837257
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        Value: 10.1007/s40820-026-02080-4
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        Text: English
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      – TitleFull: Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips.
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            NameFull: Zhang, Zheng
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            – D: 26
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              Text: 1/26/2026
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              Y: 2026
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