Three-Dimensional Topography of Wafer Bumps Based on Microscopic Fringe Projection Profilometry.
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| Title: | Three-Dimensional Topography of Wafer Bumps Based on Microscopic Fringe Projection Profilometry. |
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| Authors: | Wang, Sen1 (AUTHOR), Liu, Bin1,2 (AUTHOR) bin-liu@mail.tsinghua.edu.cn, Zhu, Haoxuan2 (AUTHOR), Feng, Zhenzhen2 (AUTHOR), Wu, Guanhao2 (AUTHOR) guanhaowu@mail.tsinghua.edu.cn |
| Source: | Nanomanufacturing & Metrology. 6/9/2026, Vol. 9 Issue 1, p1-19. 19p. |
| Database: | Academic Search Ultimate |
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| ISSN: | 2520811X |
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| DOI: | 10.1007/s41871-026-00303-1 |
