APA (7th ed.) Citation

Wang, S., Liu, B., Zhu, H., Feng, Z., & Wu, G. (2026). Three-Dimensional Topography of Wafer Bumps Based on Microscopic Fringe Projection Profilometry. Nanomanufacturing & Metrology, 9(1), 1. https://doi.org/10.1007/s41871-026-00303-1

Chicago Style (17th ed.) Citation

Wang, Sen, Bin Liu, Haoxuan Zhu, Zhenzhen Feng, and Guanhao Wu. "Three-Dimensional Topography of Wafer Bumps Based on Microscopic Fringe Projection Profilometry." Nanomanufacturing & Metrology 9, no. 1 (2026): 1. https://doi.org/10.1007/s41871-026-00303-1.

MLA (9th ed.) Citation

Wang, Sen, et al. "Three-Dimensional Topography of Wafer Bumps Based on Microscopic Fringe Projection Profilometry." Nanomanufacturing & Metrology, vol. 9, no. 1, 2026, p. 1, https://doi.org/10.1007/s41871-026-00303-1.