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Three-Dimensional Topography of Wafer Bumps Based on Microscopic Fringe Projection Profilometry.

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Title: Three-Dimensional Topography of Wafer Bumps Based on Microscopic Fringe Projection Profilometry.
Authors: Wang, Sen1 (AUTHOR), Liu, Bin1,2 (AUTHOR) bin-liu@mail.tsinghua.edu.cn, Zhu, Haoxuan2 (AUTHOR), Feng, Zhenzhen2 (AUTHOR), Wu, Guanhao2 (AUTHOR) guanhaowu@mail.tsinghua.edu.cn
Source: Nanomanufacturing & Metrology. 6/9/2026, Vol. 9 Issue 1, p1-19. 19p.
Database: Academic Search Ultimate
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  Data: Three-Dimensional Topography of Wafer Bumps Based on Microscopic Fringe Projection Profilometry.
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  Data: <searchLink fieldCode="AR" term="%22Wang%2C+Sen%22">Wang, Sen</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Liu%2C+Bin%22">Liu, Bin</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> bin-liu@mail.tsinghua.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Zhu%2C+Haoxuan%22">Zhu, Haoxuan</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Feng%2C+Zhenzhen%22">Feng, Zhenzhen</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wu%2C+Guanhao%22">Wu, Guanhao</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> guanhaowu@mail.tsinghua.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Nanomanufacturing+%26+Metrology%22">Nanomanufacturing & Metrology</searchLink>. 6/9/2026, Vol. 9 Issue 1, p1-19. 19p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=194420369
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        Value: 10.1007/s41871-026-00303-1
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        Text: English
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              Text: 6/9/2026
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              Y: 2026
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