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Next Generation System in a Package Manufacturing by Embedded Chip Technologies.

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Title: Next Generation System in a Package Manufacturing by Embedded Chip Technologies.
Authors: Boettcher, Lars1 lars.boettcher@izm.fraunhofer.de, Manessis, D.2, Karaszkiewicz, S.2, Ostmann, A.1, Reichl, H.2
Source: Journal of Microelectronic & Electronic Packaging. 2010 3rd Quarter, Vol. 7 Issue 3, p131-137. 7p. 9 Black and White Photographs, 3 Diagrams.
Database: Academic Search Ultimate
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  Data: <searchLink fieldCode="AR" term="%22Boettcher%2C+Lars%22">Boettcher, Lars</searchLink><relatesTo>1</relatesTo><i> lars.boettcher@izm.fraunhofer.de</i><br /><searchLink fieldCode="AR" term="%22Manessis%2C+D%2E%22">Manessis, D.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Karaszkiewicz%2C+S%2E%22">Karaszkiewicz, S.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Ostmann%2C+A%2E%22">Ostmann, A.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Reichl%2C+H%2E%22">Reichl, H.</searchLink><relatesTo>2</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Microelectronic+%26+Electronic+Packaging%22">Journal of Microelectronic & Electronic Packaging</searchLink>. 2010 3rd Quarter, Vol. 7 Issue 3, p131-137. 7p. 9 Black and White Photographs, 3 Diagrams.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=60072763
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              Text: 2010 3rd Quarter
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