提升 DOA 估计的孔径扩展位移填孔的互质阵列.

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Bibliographic Details
Title:	提升 DOA 估计的孔径扩展位移填孔的互质阵列.
Alternate Title:	Aperture-expanded Displacement Hole-filled Co-prime Array for Enhancing DOA Estimation.
Authors:	王桂宝¹ gbwang@sust.edu.cn, 刘云龙¹, 王向辉¹, 余可义¹, 王书振^2,3
Source:	Telecommunication Engineering. 3/28/2026, Vol. 66 Issue 3, p446-454. 9p.
Database:	Business Source Ultimate

Description
ISSN:	1001893X
DOI:	10.20079/j.issn.1001-893x.250819002