王桂宝, 刘云龙, 王向辉, 余可义, & 王书振. (2026). 提升 DOA 估计的孔径扩展位移填孔的互质阵列. Telecommunication Engineering, 66(3), 446. https://doi.org/10.20079/j.issn.1001-893x.250819002
Chicago Style (17th ed.) Citation王桂宝, 刘云龙, 王向辉, 余可义, and 王书振. "提升 DOA 估计的孔径扩展位移填孔的互质阵列." Telecommunication Engineering 66, no. 3 (2026): 446. https://doi.org/10.20079/j.issn.1001-893x.250819002.
MLA (9th ed.) Citation王桂宝, et al. "提升 DOA 估计的孔径扩展位移填孔的互质阵列." Telecommunication Engineering, vol. 66, no. 3, 2026, p. 446, https://doi.org/10.20079/j.issn.1001-893x.250819002.
Warning: These citations may not always be 100% accurate.
