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提升 DOA 估计的孔径扩展位移填孔的互质阵列.

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Title: 提升 DOA 估计的孔径扩展位移填孔的互质阵列.
Alternate Title: Aperture-expanded Displacement Hole-filled Co-prime Array for Enhancing DOA Estimation.
Authors: 王桂宝1 gbwang@sust.edu.cn, 刘云龙1, 王向辉1, 余可义1, 王书振2,3
Source: Telecommunication Engineering. 3/28/2026, Vol. 66 Issue 3, p446-454. 9p.
Database: Business Source Ultimate
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Header DbId: bsu
DbLabel: Business Source Ultimate
An: 192518313
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: 提升 DOA 估计的孔径扩展位移填孔的互质阵列.
– Name: TitleAlt
  Label: Alternate Title
  Group: TiAlt
  Data: Aperture-expanded Displacement Hole-filled Co-prime Array for Enhancing DOA Estimation.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22王桂宝%22">王桂宝</searchLink><relatesTo>1</relatesTo><i> gbwang@sust.edu.cn</i><br /><searchLink fieldCode="AR" term="%22刘云龙%22">刘云龙</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22王向辉%22">王向辉</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22余可义%22">余可义</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22王书振%22">王书振</searchLink><relatesTo>2,3</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Telecommunication+Engineering%22">Telecommunication Engineering</searchLink>. 3/28/2026, Vol. 66 Issue 3, p446-454. 9p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=bsu&AN=192518313
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.20079/j.issn.1001-893x.250819002
    Languages:
      – Code: chi
        Text: Chinese
    PhysicalDescription:
      Pagination:
        PageCount: 9
        StartPage: 446
    Titles:
      – TitleFull: 提升 DOA 估计的孔径扩展位移填孔的互质阵列.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: 王桂宝
      – PersonEntity:
          Name:
            NameFull: 刘云龙
      – PersonEntity:
          Name:
            NameFull: 王向辉
      – PersonEntity:
          Name:
            NameFull: 余可义
      – PersonEntity:
          Name:
            NameFull: 王书振
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 28
              M: 03
              Text: 3/28/2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 1001893X
          Numbering:
            – Type: volume
              Value: 66
            – Type: issue
              Value: 3
          Titles:
            – TitleFull: Telecommunication Engineering
              Type: main
ResultId 1