提升 DOA 估计的孔径扩展位移填孔的互质阵列.
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| Title: | 提升 DOA 估计的孔径扩展位移填孔的互质阵列. |
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| Alternate Title: | Aperture-expanded Displacement Hole-filled Co-prime Array for Enhancing DOA Estimation. |
| Authors: | 王桂宝1 gbwang@sust.edu.cn, 刘云龙1, 王向辉1, 余可义1, 王书振2,3 |
| Source: | Telecommunication Engineering. 3/28/2026, Vol. 66 Issue 3, p446-454. 9p. |
| Database: | Business Source Ultimate |
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