Bibliographic Details
| Title: |
Random dispersion effects of conductive particles on anisotropic conductive film's (ACF's) bonding yield. |
| Authors: |
Lin, Chao-Ming1 cmlin@mail.ncyu.edu.tw, Chi, Mao-Chieh2, Liu, Yen-Chun3 |
| Source: |
Microsystem Technologies. Jan2018, Vol. 24 Issue 1, p49-53. 5p. |
| Subjects: |
Anisotropy, Thin films, Dispersion (Chemistry), Random effects model, Reliability in engineering |
| Abstract: |
In this study, the authors try to analyze the failure probability of Anisotropic Conductive Film (ACF) packages using V-shaped curve method considering the random effects with random dispersion of conductive particles. It is shown that the dependencies of the coefficient of variation (CV) and the failure probability on the volume fraction are investigated and the results are then used to construct a correlation between the random error and the CV for a specified volume fraction. The results presented in this study have shown that the failure probability and random error are reduced as the value of the volume fraction approaches the values corresponding to the tip of the V-shaped curve. In additional, the V-shaped curves in the failure probabilities are moved from lower to higher with the increasing CV, and the optimal designed volume fraction will linearly increase with increasing CV. Hence, when specifying the composition of the ACF compound with any random error, the volume fraction should be assigned the tip value in order to maximize the reliability of the failure probability. [ABSTRACT FROM AUTHOR] |
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| Database: |
Engineering Source |