APA (7th ed.) Citation

Lin, C., Chi, M., & Liu, Y. (2018). Random dispersion effects of conductive particles on anisotropic conductive film's (ACF's) bonding yield. Microsystem Technologies, 24(1), 49. https://doi.org/10.1007/s00542-016-3153-3

Chicago Style (17th ed.) Citation

Lin, Chao-Ming, Mao-Chieh Chi, and Yen-Chun Liu. "Random Dispersion Effects of Conductive Particles on Anisotropic Conductive Film's (ACF's) Bonding Yield." Microsystem Technologies 24, no. 1 (2018): 49. https://doi.org/10.1007/s00542-016-3153-3.

MLA (9th ed.) Citation

Lin, Chao-Ming, et al. "Random Dispersion Effects of Conductive Particles on Anisotropic Conductive Film's (ACF's) Bonding Yield." Microsystem Technologies, vol. 24, no. 1, 2018, p. 49, https://doi.org/10.1007/s00542-016-3153-3.