APA (7th ed.) Citation

Choi, H., Kim, K., Son, S., Lee, D., Je, S., Kang, J., . . . Kim, T. (2025). Cu-Contamination-Free Hybrid Bonding via MoS 2 Passivation Layer. Nanomaterials (2079-4991), 15(20), 1600. https://doi.org/10.3390/nano15201600

Chicago Style (17th ed.) Citation

Choi, Hyunbin, et al. "Cu-Contamination-Free Hybrid Bonding via MoS 2 Passivation Layer." Nanomaterials (2079-4991) 15, no. 20 (2025): 1600. https://doi.org/10.3390/nano15201600.

MLA (9th ed.) Citation

Choi, Hyunbin, et al. "Cu-Contamination-Free Hybrid Bonding via MoS 2 Passivation Layer." Nanomaterials (2079-4991), vol. 15, no. 20, 2025, p. 1600, https://doi.org/10.3390/nano15201600.