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ISTFA 2025 AND THE NEXT ERA OF FAILURE ANALYSIS.

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Title: ISTFA 2025 AND THE NEXT ERA OF FAILURE ANALYSIS.
Authors: Parente, Renee S. renee.parente@amd.com
Source: Electronic Device Failure Analysis. Feb2026, Vol. 28 Issue 1, p22-24. 3p.
Subjects: Failure analysis, Heterogeneous computing, Information technology, Moore's law, Microelectronics, Electronic packaging
Abstract: The article reflects on ISTFA 2025 as a pivotal moment for the failure analysis community, highlighting strong global engagement and a shared commitment to addressing the challenges of heterogeneous computing and advanced packaging beyond Moore's Law. Topics include key themes and outcomes of ISTFA 2025, emerging failure analysis challenges driven by advanced architectures, and the importance of collaboration, innovation and policy awareness in the future of microelectronics.
Database: Engineering Source
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  Data: ISTFA 2025 AND THE NEXT ERA OF FAILURE ANALYSIS.
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  Data: <searchLink fieldCode="DE" term="%22Failure+analysis%22">Failure analysis</searchLink><br /><searchLink fieldCode="DE" term="%22Heterogeneous+computing%22">Heterogeneous computing</searchLink><br /><searchLink fieldCode="DE" term="%22Information+technology%22">Information technology</searchLink><br /><searchLink fieldCode="DE" term="%22Moore's+law%22">Moore's law</searchLink><br /><searchLink fieldCode="DE" term="%22Microelectronics%22">Microelectronics</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink>
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  Data: The article reflects on ISTFA 2025 as a pivotal moment for the failure analysis community, highlighting strong global engagement and a shared commitment to addressing the challenges of heterogeneous computing and advanced packaging beyond Moore's Law. Topics include key themes and outcomes of ISTFA 2025, emerging failure analysis challenges driven by advanced architectures, and the importance of collaboration, innovation and policy awareness in the future of microelectronics.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=191336855
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      – Code: eng
        Text: English
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      – SubjectFull: Failure analysis
        Type: general
      – SubjectFull: Heterogeneous computing
        Type: general
      – SubjectFull: Information technology
        Type: general
      – SubjectFull: Moore's law
        Type: general
      – SubjectFull: Microelectronics
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      – SubjectFull: Electronic packaging
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      – TitleFull: ISTFA 2025 AND THE NEXT ERA OF FAILURE ANALYSIS.
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              Text: Feb2026
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              Y: 2026
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