Mask aligners in advanced packaging.
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| Title: | Mask aligners in advanced packaging. |
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| Authors: | Tonnies, Dietrich, Topper, Michael |
| Source: | Solid State Technology. Mar98, Vol. 41 Issue 3, pS13. 4p. 6 Color Photographs, 9 Black and White Photographs, 1 Diagram. |
| Subjects: | Photolithography, Integrated circuits |
| Abstract: | Demonstrates the efficiency of photolithography by proximity printing with a mask aligner in the fabrication of high-density interconnect layers and tape automated bonding (TAB) or solder bumps in the integrated circuits industry. Chip scale packaging (CSP) technology developed at the Technical University and the Fraunhofer Institute IZM in Berlin, Germany; Combination of multichip modules (MCM) and MCM-D substrates. |
| Database: | Engineering Source |
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| Abstract: | Demonstrates the efficiency of photolithography by proximity printing with a mask aligner in the fabrication of high-density interconnect layers and tape automated bonding (TAB) or solder bumps in the integrated circuits industry. Chip scale packaging (CSP) technology developed at the Technical University and the Fraunhofer Institute IZM in Berlin, Germany; Combination of multichip modules (MCM) and MCM-D substrates. |
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| ISSN: | 0038111X |
