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Mask aligners in advanced packaging.

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Bibliographic Details
Title: Mask aligners in advanced packaging.
Authors: Tonnies, Dietrich, Topper, Michael
Source: Solid State Technology. Mar98, Vol. 41 Issue 3, pS13. 4p. 6 Color Photographs, 9 Black and White Photographs, 1 Diagram.
Subjects: Photolithography, Integrated circuits
Abstract: Demonstrates the efficiency of photolithography by proximity printing with a mask aligner in the fabrication of high-density interconnect layers and tape automated bonding (TAB) or solder bumps in the integrated circuits industry. Chip scale packaging (CSP) technology developed at the Technical University and the Fraunhofer Institute IZM in Berlin, Germany; Combination of multichip modules (MCM) and MCM-D substrates.
Database: Engineering Source
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  Availability: 1
Header DbId: egs
DbLabel: Engineering Source
An: 403802
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
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  Data: Mask aligners in advanced packaging.
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  Data: <searchLink fieldCode="AR" term="%22Tonnies%2C+Dietrich%22">Tonnies, Dietrich</searchLink><br /><searchLink fieldCode="AR" term="%22Topper%2C+Michael%22">Topper, Michael</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Solid+State+Technology%22">Solid State Technology</searchLink>. Mar98, Vol. 41 Issue 3, pS13. 4p. 6 Color Photographs, 9 Black and White Photographs, 1 Diagram.
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  Data: Demonstrates the efficiency of photolithography by proximity printing with a mask aligner in the fabrication of high-density interconnect layers and tape automated bonding (TAB) or solder bumps in the integrated circuits industry. Chip scale packaging (CSP) technology developed at the Technical University and the Fraunhofer Institute IZM in Berlin, Germany; Combination of multichip modules (MCM) and MCM-D substrates.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=403802
RecordInfo BibRecord:
  BibEntity:
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 4
        StartPage: S13
    Subjects:
      – SubjectFull: Photolithography
        Type: general
      – SubjectFull: Integrated circuits
        Type: general
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      – TitleFull: Mask aligners in advanced packaging.
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          Name:
            NameFull: Tonnies, Dietrich
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            NameFull: Topper, Michael
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            – D: 01
              M: 03
              Text: Mar98
              Type: published
              Y: 1998
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              Value: 41
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            – TitleFull: Solid State Technology
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