Direct observation of a Ti/Cu interface with atomic displacement under electron irradiation.
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| Title: | Direct observation of a Ti/Cu interface with atomic displacement under electron irradiation. |
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| Authors: | Ohta, S.1, Sakaguchi, N.2, Shibayama, T.2, Takahashi, H.2 |
| Source: | Journal of Microscopy. Jul2001, Vol. 203 Issue 1, p34-39. 6p. 4 Black and White Photographs, 1 Diagram, 2 Graphs. |
| Subjects: | Interfaces (Physical sciences), Irradiation, Titanium, Copper, In situ bioremediation |
| Abstract: | A Ti film was deposited onto a Cu substrate by means of a radio frequency magnetron sputtering method. Cross-sectional thin foils for TEM observation were prepared using a focused ion beam. Electron irradiation was carried out using a high-resolution high-voltage electron microscope operated at 1.25 MV. The Cu/Ti interface of the foils was irradiated at 623 K. In-situ observation images during electron irradiation were recorded by a CCD camera with a digital video cassette. The (020)Cu plane on the Cu/Ti interface preferentially moved towards the Ti film with irradiation. Composition analysis of the diffused region showed that its composition corresponded to Ti3Cu2. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Microscopy is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Header | DbId: egs DbLabel: Engineering Source An: 4756043 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Direct observation of a Ti/Cu interface with atomic displacement under electron irradiation. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Ohta%2C+S%2E%22">Ohta, S.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Sakaguchi%2C+N%2E%22">Sakaguchi, N.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Shibayama%2C+T%2E%22">Shibayama, T.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Takahashi%2C+H%2E%22">Takahashi, H.</searchLink><relatesTo>2</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Microscopy%22">Journal of Microscopy</searchLink>. Jul2001, Vol. 203 Issue 1, p34-39. 6p. 4 Black and White Photographs, 1 Diagram, 2 Graphs. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Interfaces+%28Physical+sciences%29%22">Interfaces (Physical sciences)</searchLink><br /><searchLink fieldCode="DE" term="%22Irradiation%22">Irradiation</searchLink><br /><searchLink fieldCode="DE" term="%22Titanium%22">Titanium</searchLink><br /><searchLink fieldCode="DE" term="%22Copper%22">Copper</searchLink><br /><searchLink fieldCode="DE" term="%22In+situ+bioremediation%22">In situ bioremediation</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: A Ti film was deposited onto a Cu substrate by means of a radio frequency magnetron sputtering method. Cross-sectional thin foils for TEM observation were prepared using a focused ion beam. Electron irradiation was carried out using a high-resolution high-voltage electron microscope operated at 1.25 MV. The Cu/Ti interface of the foils was irradiated at 623 K. In-situ observation images during electron irradiation were recorded by a CCD camera with a digital video cassette. The (020)Cu plane on the Cu/Ti interface preferentially moved towards the Ti film with irradiation. Composition analysis of the diffused region showed that its composition corresponded to Ti3Cu2. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Microscopy is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1046/j.1365-2818.2001.00912.x Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 6 StartPage: 34 Subjects: – SubjectFull: Interfaces (Physical sciences) Type: general – SubjectFull: Irradiation Type: general – SubjectFull: Titanium Type: general – SubjectFull: Copper Type: general – SubjectFull: In situ bioremediation Type: general Titles: – TitleFull: Direct observation of a Ti/Cu interface with atomic displacement under electron irradiation. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Ohta, S. – PersonEntity: Name: NameFull: Sakaguchi, N. – PersonEntity: Name: NameFull: Shibayama, T. – PersonEntity: Name: NameFull: Takahashi, H. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 07 Text: Jul2001 Type: published Y: 2001 Identifiers: – Type: issn-print Value: 00222720 Numbering: – Type: volume Value: 203 – Type: issue Value: 1 Titles: – TitleFull: Journal of Microscopy Type: main |
| ResultId | 1 |