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Centip3De: A Cluster-Based NTC Architecture With 64 ARM Cortex-M3 Cores in 3D Stacked 130 nm CMOS.

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Bibliographic Details
Title:	Centip3De: A Cluster-Based NTC Architecture With 64 ARM Cortex-M3 Cores in 3D Stacked 130 nm CMOS.
Authors:	Fick, David¹, Dreslinski, Ronald G.¹, Giridhar, Bharan¹, Kim, Gyouho¹, Seo, Sangwon², Fojtik, Matthew¹, Satpathy, Sudhir³, Lee, Yoonmyung¹, Kim, Daeyeon³, Liu, Nurrachman⁴, Wieckowski, Michael⁵, Chen, Gregory³, Mudge, Trevor¹, Blaauw, David¹, Sylvester, Dennis¹
Source:	IEEE Journal of Solid-State Circuits. Jan2013, Vol. 48 Issue 1, p104-117. 14p.
Subjects:	Computer architecture, Complementary metal oxide semiconductors, Energy consumption, Feasibility studies, Cache memory, Performance evaluation
Abstract:	We present Centip3De, a large-scale 3D CMP with a cluster-based near-threshold computing (NTC) architecture. Centip3De uses a 3D stacking technology in conjunction with 130\,nm CMOS. Measured results for a two-layer, 64-core system are discussed, with the system achieving 3930 DMIPS/W energy efficiency, which is >\,3x improvement over traditional operation at full supply voltage. This project demonstrates the feasibility of large-scale 3D design, a synergy between 3D and NTC architectures, a unique cluster-based NTC cache design, and how to maximize performance in a thermally-constrained design. [ABSTRACT FROM AUTHOR]
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Database:	Engineering Source

Description
Abstract:	We present Centip3De, a large-scale 3D CMP with a cluster-based near-threshold computing (NTC) architecture. Centip3De uses a 3D stacking technology in conjunction with 130\,nm CMOS. Measured results for a two-layer, 64-core system are discussed, with the system achieving 3930 DMIPS/W energy efficiency, which is >\,3x improvement over traditional operation at full supply voltage. This project demonstrates the feasibility of large-scale 3D design, a synergy between 3D and NTC architectures, a unique cluster-based NTC cache design, and how to maximize performance in a thermally-constrained design. [ABSTRACT FROM AUTHOR]
ISSN:	00189200
DOI:	10.1109/JSSC.2012.2222814