Extreme extensibility of copper foil under compound forming conditions.

Saved in:
Bibliographic Details
Title: Extreme extensibility of copper foil under compound forming conditions.
Authors: Yu Q; 1] Research Institute of Science and Technology, Northeastern University, Shenyang 110819, China [2] Mechanical and Electronic Engineering College, Xuzhou Institute of Technology, Xuzhou 221008, China., Liu X; Research Institute of Science and Technology, Northeastern University, Shenyang 110819, China., Tang D; Research Institute of Science and Technology, Northeastern University, Shenyang 110819, China.
Source: Scientific reports [Sci Rep] 2013 Dec 19; Vol. 3, pp. 3556. Date of Electronic Publication: 2013 Dec 19.
Publication Type: Journal Article; Research Support, Non-U.S. Gov't
Journal Info: Publisher: Nature Publishing Group Country of Publication: England NLM ID: 101563288 Publication Model: Electronic Cited Medium: Internet ISSN: 2045-2322 (Electronic) Linking ISSN: 20452322 NLM ISO Abbreviation: Sci Rep Subsets: PubMed not MEDLINE
Database: MEDLINE Ultimate
Description
ISSN:2045-2322
DOI:10.1038/srep03556