| Authors: |
Pandhi T; Micron School of Materials Science and Engineering, Boise State University, Boise, ID, 83725, United States., Kreit E; KBRwyle, 2601 Mission Point Blvd, Suite 300, Beavercreek, OH, 45431, United States., Aga R; KBRwyle, 2601 Mission Point Blvd, Suite 300, Beavercreek, OH, 45431, United States., Fujimoto K; Micron School of Materials Science and Engineering, Boise State University, Boise, ID, 83725, United States., Sharbati MT; Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, 15261, United States., Khademi S; Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, 15261, United States., Chang AN; Micron School of Materials Science and Engineering, Boise State University, Boise, ID, 83725, United States., Xiong F; Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA, 15261, United States., Koehne J; NASA Ames Research Center, Moffett Field, CA, 94035, United States., Heckman EM; Air Force Research Laboratory, Sensors Directorate, 2241 Avionics Circle, Wright-Patterson AFB, OH, 45433, United States. emily.heckman.1@us.af.mil., Estrada D; Micron School of Materials Science and Engineering, Boise State University, Boise, ID, 83725, United States. daveestrada@boisestate.edu. |
