| Authors: |
Yi S; Department of Electrical and Computer Engineering, University of Wisconsin, Madison, WI, USA., Zhou M; Department of Electrical and Computer Engineering, University of Wisconsin, Madison, WI, USA., Yu Z; Department of Electrical and Computer Engineering, University of Wisconsin, Madison, WI, USA. zyu54@wisc.edu., Fan P; Geballe Laboratory for Advanced Materials, Stanford, CA, USA., Behdad N; Department of Electrical and Computer Engineering, University of Wisconsin, Madison, WI, USA., Lin D; Geballe Laboratory for Advanced Materials, Stanford, CA, USA.; Department of Electrical Engineering, Stanford University, Stanford, CA, USA., Wang KX; Ginzton Laboratory, Stanford University, Stanford, CA, USA., Fan S; Department of Electrical Engineering, Stanford University, Stanford, CA, USA.; Ginzton Laboratory, Stanford University, Stanford, CA, USA., Brongersma M; Geballe Laboratory for Advanced Materials, Stanford, CA, USA. brongersma@stanford.edu. |
