| Authors: |
Oh YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Kim JH; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Xie Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China., Cho S; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Han H; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Jeon SW; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA., Park M; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Namkoong M; Department of Biomedical Engineering, Texas A&M University, College Station, TX, USA., Avila R; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Song Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China., Lee SU; Advanced 3D Printing Technology Development Division, Korea Atomic Energy Research Institute, Daejeon, Republic of Korea., Ko K; Qualcomm Institute, La Jolla, CA, USA., Lee J; Sibel Health Inc, Niles, IL, USA., Lee JS; Department of Rehabilitation Medicine, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea., Min WG; Department of Planning and Development, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea., Lee BJ; Department of Rehabilitation Medicine, Pusan national university hospital, Busan, Republic of Korea., Choi M; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Chung HU; Sibel Health Inc, Niles, IL, USA., Kim J; Sibel Health Inc, Niles, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Kyung Hee University, Yongin, Republic of Korea., Han M; Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, People's Republic of China., Koo J; School of Biomedical Engineering, Korea University, Seoul, Republic of Korea.; Interdisciplinary Program in Precision Public Health, Korea University, Seoul, Republic of Korea., Choi YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Kwak SS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Kim SB; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Kim J; Department of Electronic Convergence Engineering, Kwangwoon University, Seoul, Republic of Korea., Choi J; School of Mechanical Engineering, Kookmin University, Seoul, Republic of Korea., Kang CM; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA., Kim JU; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea., Kwon K; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Won SM; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea., Baek JM; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA., Lee Y; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA., Kim SY; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA., Lu W; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA., Vazquez-Guardado A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Jeong H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Ryu H; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA., Lee G; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Kim K; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Kim S; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Kim MS; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Choi J; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Choi DY; Biomedical Manufacturing Technology Center, Korea Institute of Industrial Technology (KITECH), Yeongcheon, Republic of Korea., Yang Q; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Zhao H; Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, USA., Bai W; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA., Jang H; Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI, USA., Yu Y; NeuroLux, Inc, Glenview, IL, USA., Lim J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Guo X; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China., Kim BH; Department of Organic Materials and Fiber Engineering, Soongsil University, Seoul, Republic of Korea., Jeon S; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Davies C; Carle Neuroscience Institute, Carle, Physician Group, Urbana, IL, USA., Banks A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Sung HJ; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Huang Y; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu., Park I; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. inkyu@kaist.ac.kr., Rogers JA; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, USA. jrogers@northwestern.edu. |
