Author Correction: Battery-free, wireless soft sensors for continuous multi-site measurements of pressure and temperature from patients at risk for pressure injuries.
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| Title: | Author Correction: Battery-free, wireless soft sensors for continuous multi-site measurements of pressure and temperature from patients at risk for pressure injuries. |
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| Authors: | Oh YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Kim JH; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Xie Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China., Cho S; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Han H; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Jeon SW; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA., Park M; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Namkoong M; Department of Biomedical Engineering, Texas A&M University, College Station, TX, USA., Avila R; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Song Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China., Lee SU; Advanced 3D Printing Technology Development Division, Korea Atomic Energy Research Institute, Daejeon, Republic of Korea., Ko K; Qualcomm Institute, La Jolla, CA, USA., Lee J; Sibel Health Inc, Niles, IL, USA., Lee JS; Department of Rehabilitation Medicine, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea., Min WG; Department of Planning and Development, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea., Lee BJ; Department of Rehabilitation Medicine, Pusan national university hospital, Busan, Republic of Korea., Choi M; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Chung HU; Sibel Health Inc, Niles, IL, USA., Kim J; Sibel Health Inc, Niles, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Kyung Hee University, Yongin, Republic of Korea., Han M; Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, People's Republic of China., Koo J; School of Biomedical Engineering, Korea University, Seoul, Republic of Korea.; Interdisciplinary Program in Precision Public Health, Korea University, Seoul, Republic of Korea., Choi YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Kwak SS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Kim SB; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Kim J; Department of Electronic Convergence Engineering, Kwangwoon University, Seoul, Republic of Korea., Choi J; School of Mechanical Engineering, Kookmin University, Seoul, Republic of Korea., Kang CM; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA., Kim JU; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea., Kwon K; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Won SM; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea., Baek JM; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA., Lee Y; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA., Kim SY; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA., Lu W; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA., Vazquez-Guardado A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Jeong H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Ryu H; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA., Lee G; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Kim K; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Kim S; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Kim MS; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Choi J; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Choi DY; Biomedical Manufacturing Technology Center, Korea Institute of Industrial Technology (KITECH), Yeongcheon, Republic of Korea., Yang Q; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Zhao H; Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, USA., Bai W; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA., Jang H; Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI, USA., Yu Y; NeuroLux, Inc, Glenview, IL, USA., Lim J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Guo X; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China., Kim BH; Department of Organic Materials and Fiber Engineering, Soongsil University, Seoul, Republic of Korea., Jeon S; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Davies C; Carle Neuroscience Institute, Carle, Physician Group, Urbana, IL, USA., Banks A; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Sung HJ; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Huang Y; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu., Park I; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. inkyu@kaist.ac.kr., Rogers JA; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, USA. jrogers@northwestern.edu. |
| Source: | Nature communications [Nat Commun] 2021 Nov 18; Vol. 12 (1), pp. 6827. Date of Electronic Publication: 2021 Nov 18. |
| Publication Type: | Published Erratum |
| Journal Info: | Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE; PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: mdl DbLabel: MEDLINE Ultimate An: 34795252 AccessLevel: 2 PubTypeId: unknown PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Author Correction: Battery-free, wireless soft sensors for continuous multi-site measurements of pressure and temperature from patients at risk for pressure injuries. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Oh+YS%22">Oh YS</searchLink>; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Kim+JH%22">Kim JH</searchLink>; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Xie+Z%22">Xie Z</searchLink>; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.<br /><searchLink fieldCode="AU" term="%22Cho+S%22">Cho S</searchLink>; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Han+H%22">Han H</searchLink>; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Jeon+SW%22">Jeon SW</searchLink>; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.<br /><searchLink fieldCode="AU" term="%22Park+M%22">Park M</searchLink>; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Namkoong+M%22">Namkoong M</searchLink>; Department of Biomedical Engineering, Texas A&M University, College Station, TX, USA.<br /><searchLink fieldCode="AU" term="%22Avila+R%22">Avila R</searchLink>; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Song+Z%22">Song Z</searchLink>; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.<br /><searchLink fieldCode="AU" term="%22Lee+SU%22">Lee SU</searchLink>; Advanced 3D Printing Technology Development Division, Korea Atomic Energy Research Institute, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Ko+K%22">Ko K</searchLink>; Qualcomm Institute, La Jolla, CA, USA.<br /><searchLink fieldCode="AU" term="%22Lee+J%22">Lee J</searchLink>; Sibel Health Inc, Niles, IL, USA.<br /><searchLink fieldCode="AU" term="%22Lee+JS%22">Lee JS</searchLink>; Department of Rehabilitation Medicine, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Min+WG%22">Min WG</searchLink>; Department of Planning and Development, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Lee+BJ%22">Lee BJ</searchLink>; Department of Rehabilitation Medicine, Pusan national university hospital, Busan, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Choi+M%22">Choi M</searchLink>; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Chung+HU%22">Chung HU</searchLink>; Sibel Health Inc, Niles, IL, USA.<br /><searchLink fieldCode="AU" term="%22Kim+J%22">Kim J</searchLink>; Sibel Health Inc, Niles, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Kyung Hee University, Yongin, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Han+M%22">Han M</searchLink>; Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, People's Republic of China.<br /><searchLink fieldCode="AU" term="%22Koo+J%22">Koo J</searchLink>; School of Biomedical Engineering, Korea University, Seoul, Republic of Korea.; Interdisciplinary Program in Precision Public Health, Korea University, Seoul, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Choi+YS%22">Choi YS</searchLink>; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Kwak+SS%22">Kwak SS</searchLink>; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Kim+SB%22">Kim SB</searchLink>; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Kim+J%22">Kim J</searchLink>; Department of Electronic Convergence Engineering, Kwangwoon University, Seoul, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Choi+J%22">Choi J</searchLink>; School of Mechanical Engineering, Kookmin University, Seoul, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Kang+CM%22">Kang CM</searchLink>; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Kim+JU%22">Kim JU</searchLink>; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Kwon+K%22">Kwon K</searchLink>; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Won+SM%22">Won SM</searchLink>; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Baek+JM%22">Baek JM</searchLink>; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.<br /><searchLink fieldCode="AU" term="%22Lee+Y%22">Lee Y</searchLink>; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.<br /><searchLink fieldCode="AU" term="%22Kim+SY%22">Kim SY</searchLink>; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.<br /><searchLink fieldCode="AU" term="%22Lu+W%22">Lu W</searchLink>; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Vazquez-Guardado+A%22">Vazquez-Guardado A</searchLink>; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Jeong+H%22">Jeong H</searchLink>; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Ryu+H%22">Ryu H</searchLink>; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Lee+G%22">Lee G</searchLink>; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Kim+K%22">Kim K</searchLink>; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Kim+S%22">Kim S</searchLink>; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Kim+MS%22">Kim MS</searchLink>; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Choi+J%22">Choi J</searchLink>; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Choi+DY%22">Choi DY</searchLink>; Biomedical Manufacturing Technology Center, Korea Institute of Industrial Technology (KITECH), Yeongcheon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Yang+Q%22">Yang Q</searchLink>; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Zhao+H%22">Zhao H</searchLink>; Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, USA.<br /><searchLink fieldCode="AU" term="%22Bai+W%22">Bai W</searchLink>; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA.<br /><searchLink fieldCode="AU" term="%22Jang+H%22">Jang H</searchLink>; Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI, USA.<br /><searchLink fieldCode="AU" term="%22Yu+Y%22">Yu Y</searchLink>; NeuroLux, Inc, Glenview, IL, USA.<br /><searchLink fieldCode="AU" term="%22Lim+J%22">Lim J</searchLink>; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Guo+X%22">Guo X</searchLink>; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.<br /><searchLink fieldCode="AU" term="%22Kim+BH%22">Kim BH</searchLink>; Department of Organic Materials and Fiber Engineering, Soongsil University, Seoul, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Jeon+S%22">Jeon S</searchLink>; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Davies+C%22">Davies C</searchLink>; Carle Neuroscience Institute, Carle, Physician Group, Urbana, IL, USA.<br /><searchLink fieldCode="AU" term="%22Banks+A%22">Banks A</searchLink>; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Sung+HJ%22">Sung HJ</searchLink>; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Huang+Y%22">Huang Y</searchLink>; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.<br /><searchLink fieldCode="AU" term="%22Park+I%22">Park I</searchLink>; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. inkyu@kaist.ac.kr.<br /><searchLink fieldCode="AU" term="%22Rogers+JA%22">Rogers JA</searchLink>; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, USA. jrogers@northwestern.edu. – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22101528555%22">Nature communications</searchLink> [Nat Commun] 2021 Nov 18; Vol. 12 (1), pp. 6827. <i>Date of Electronic Publication: </i>2021 Nov 18. – Name: TypePub Label: Publication Type Group: TypPub Data: Published Erratum – Name: TitleSource Label: Journal Info Group: Src Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22Nature+Pub%2E+Group%22">Nature Pub. Group </searchLink><i>Country of Publication: </i>England <i>NLM ID: </i>101528555 <i>Publication Model: </i>Electronic <i>Cited Medium: </i>Internet <i>ISSN: </i>2041-1723 (Electronic) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2220411723%22">20411723 </searchLink><i>NLM ISO Abbreviation: </i>Nat Commun <i>Subsets: </i>MEDLINE; PubMed not MEDLINE |
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