Soft, bioresorbable coolers for reversible conduction block of peripheral nerves.
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| Title: | Soft, bioresorbable coolers for reversible conduction block of peripheral nerves. |
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| Authors: | Reeder JT; Knight Campus for Accelerating Scientific Impact, University of Oregon, Eugene, OR, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Xie Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.; Ningbo Institute of Dalian University of Technology, Ningbo, China., Yang Q; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Seo MH; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; School of Biomedical Convergence Engineering, College of Information and Biomedical Engineering, Pusan National University, Busan, Republic of Korea., Yan Y; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, USA., Deng Y; State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, China., Jinkins KR; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Krishnan SR; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Liu C; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA., McKay S; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA., Patnaude E; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA., Johnson A; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA., Zhao Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.; Ningbo Institute of Dalian University of Technology, Ningbo, China., Kim MJ; Department of Chemical Engineering, Northwestern University, Evanston, IL, USA., Xu Y; The Institute of Materials Science and Engineering, Washington University, St. Louis, MO, USA., Huang I; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Avila R; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Felicelli C; Department of Pathology, Northwestern University, Evanston, IL, USA., Ray E; Department of Biomedical Engineering, Washington University, St. Louis, MO, USA., Guo X; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.; Ningbo Institute of Dalian University of Technology, Ningbo, China., Ray WZ; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, USA.; Department of Biomedical Engineering, Washington University, St. Louis, MO, USA., Huang Y; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA., MacEwan MR; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, USA.; Department of Biomedical Engineering, Washington University, St. Louis, MO, USA., Rogers JA; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.; Department of Chemistry, Northwestern University, Evanston, IL, USA.; Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Evanston, IL, USA. |
| Source: | Science (New York, N.Y.) [Science] 2022 Jul; Vol. 377 (6601), pp. 109-115. Date of Electronic Publication: 2022 Jun 30. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: American Association for the Advancement of Science Country of Publication: United States NLM ID: 0404511 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1095-9203 (Electronic) Linking ISSN: 00368075 NLM ISO Abbreviation: Science Subsets: MEDLINE |
| Database: | MEDLINE Ultimate |
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| ISSN: | 1095-9203 |
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| DOI: | 10.1126/science.abl8532 |
