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Soft, bioresorbable coolers for reversible conduction block of peripheral nerves.

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Title: Soft, bioresorbable coolers for reversible conduction block of peripheral nerves.
Authors: Reeder JT; Knight Campus for Accelerating Scientific Impact, University of Oregon, Eugene, OR, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Xie Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.; Ningbo Institute of Dalian University of Technology, Ningbo, China., Yang Q; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Seo MH; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; School of Biomedical Convergence Engineering, College of Information and Biomedical Engineering, Pusan National University, Busan, Republic of Korea., Yan Y; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, USA., Deng Y; State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, China., Jinkins KR; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Krishnan SR; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Liu C; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA., McKay S; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA., Patnaude E; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA., Johnson A; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA., Zhao Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.; Ningbo Institute of Dalian University of Technology, Ningbo, China., Kim MJ; Department of Chemical Engineering, Northwestern University, Evanston, IL, USA., Xu Y; The Institute of Materials Science and Engineering, Washington University, St. Louis, MO, USA., Huang I; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Avila R; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Felicelli C; Department of Pathology, Northwestern University, Evanston, IL, USA., Ray E; Department of Biomedical Engineering, Washington University, St. Louis, MO, USA., Guo X; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.; Ningbo Institute of Dalian University of Technology, Ningbo, China., Ray WZ; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, USA.; Department of Biomedical Engineering, Washington University, St. Louis, MO, USA., Huang Y; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA., MacEwan MR; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, USA.; Department of Biomedical Engineering, Washington University, St. Louis, MO, USA., Rogers JA; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.; Department of Chemistry, Northwestern University, Evanston, IL, USA.; Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Evanston, IL, USA.
Source: Science (New York, N.Y.) [Science] 2022 Jul; Vol. 377 (6601), pp. 109-115. Date of Electronic Publication: 2022 Jun 30.
Publication Type: Journal Article
Journal Info: Publisher: American Association for the Advancement of Science Country of Publication: United States NLM ID: 0404511 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1095-9203 (Electronic) Linking ISSN: 00368075 NLM ISO Abbreviation: Science Subsets: MEDLINE
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  Data: <searchLink fieldCode="AU" term="%22Reeder+JT%22">Reeder JT</searchLink>; Knight Campus for Accelerating Scientific Impact, University of Oregon, Eugene, OR, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Xie+Z%22">Xie Z</searchLink>; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.; Ningbo Institute of Dalian University of Technology, Ningbo, China.<br /><searchLink fieldCode="AU" term="%22Yang+Q%22">Yang Q</searchLink>; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Seo+MH%22">Seo MH</searchLink>; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; School of Biomedical Convergence Engineering, College of Information and Biomedical Engineering, Pusan National University, Busan, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Yan+Y%22">Yan Y</searchLink>; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, USA.<br /><searchLink fieldCode="AU" term="%22Deng+Y%22">Deng Y</searchLink>; State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, China.<br /><searchLink fieldCode="AU" term="%22Jinkins+KR%22">Jinkins KR</searchLink>; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Krishnan+SR%22">Krishnan SR</searchLink>; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Liu+C%22">Liu C</searchLink>; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22McKay+S%22">McKay S</searchLink>; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Patnaude+E%22">Patnaude E</searchLink>; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Johnson+A%22">Johnson A</searchLink>; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Zhao+Z%22">Zhao Z</searchLink>; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.; Ningbo Institute of Dalian University of Technology, Ningbo, China.<br /><searchLink fieldCode="AU" term="%22Kim+MJ%22">Kim MJ</searchLink>; Department of Chemical Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Xu+Y%22">Xu Y</searchLink>; The Institute of Materials Science and Engineering, Washington University, St. Louis, MO, USA.<br /><searchLink fieldCode="AU" term="%22Huang+I%22">Huang I</searchLink>; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Avila+R%22">Avila R</searchLink>; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Felicelli+C%22">Felicelli C</searchLink>; Department of Pathology, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22Ray+E%22">Ray E</searchLink>; Department of Biomedical Engineering, Washington University, St. Louis, MO, USA.<br /><searchLink fieldCode="AU" term="%22Guo+X%22">Guo X</searchLink>; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.; Ningbo Institute of Dalian University of Technology, Ningbo, China.<br /><searchLink fieldCode="AU" term="%22Ray+WZ%22">Ray WZ</searchLink>; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, USA.; Department of Biomedical Engineering, Washington University, St. Louis, MO, USA.<br /><searchLink fieldCode="AU" term="%22Huang+Y%22">Huang Y</searchLink>; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.<br /><searchLink fieldCode="AU" term="%22MacEwan+MR%22">MacEwan MR</searchLink>; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO, USA.; Department of Biomedical Engineering, Washington University, St. Louis, MO, USA.<br /><searchLink fieldCode="AU" term="%22Rogers+JA%22">Rogers JA</searchLink>; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.; Department of Chemistry, Northwestern University, Evanston, IL, USA.; Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Evanston, IL, USA.
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  Data: <searchLink fieldCode="JN" term="%220404511%22">Science (New York, N.Y.)</searchLink> [Science] 2022 Jul; Vol. 377 (6601), pp. 109-115. <i>Date of Electronic Publication: </i>2022 Jun 30.
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