| Authors: |
Ouyang W; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Lu W; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Zhang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Liu Y; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA., Kim JU; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea., Shen H; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Wu Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Luan H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Kilner K; Neurolux Inc., Northfield, IL, USA., Lee SP; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Neurolux Inc., Northfield, IL, USA., Lu Y; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Yang Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Wang J; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Yu Y; Neurolux Inc., Northfield, IL, USA., Wegener AJ; US Army Research Laboratory, Aberdeen Proving Ground, MD, USA.; US Army Medical Research Institute of Chemical Defense, Aberdeen Proving Ground, MD, USA., Moreno JA; US Army Research Laboratory, Aberdeen Proving Ground, MD, USA.; US Army Medical Research Institute of Chemical Defense, Aberdeen Proving Ground, MD, USA.; SURVICE Engineering, Belcamp, MD, USA., Xie Z; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA., Wu Y; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Won SM; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea., Kwon K; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea., Wu C; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Bai W; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA., Guo H; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Liu TL; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Bai H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Monti G; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA., Zhu J; Department of Chemical and Biological Engineering, Northwestern University, Evanston, IL, USA.; Department of Chemistry, Northwestern University, Evanston, IL, USA., Madhvapathy SR; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA., Trueb J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Stanslaski M; Neurolux Inc., Northfield, IL, USA., Higbee-Dempsey EM; Developmental Therapeutics Core, Northwestern University, Evanston, IL, USA., Stepien I; Developmental Therapeutics Core, Northwestern University, Evanston, IL, USA., Ghoreishi-Haack N; Developmental Therapeutics Core, Northwestern University, Evanston, IL, USA., Haney CR; Center for Advanced Molecular Imaging, Northwestern University, Evanston, IL, USA., Kim TI; School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea.; Biomedical Institute for Convergence at SKKU (BICS), Sungkyunkwan University (SKKU), Suwon, Republic of Korea., Huang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA., Ghaffari R; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Neurolux Inc., Northfield, IL, USA., Banks AR; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Neurolux Inc., Northfield, IL, USA., Jhou TC; Department of Neurosciences, Medical University of South Carolina, Charleston, SC, USA. jhou@musc.edu., Good CH; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. cameron.good@northwestern.edu.; Neurolux Inc., Northfield, IL, USA. cameron.good@northwestern.edu.; US Army Research Laboratory, Aberdeen Proving Ground, MD, USA. cameron.good@northwestern.edu.; US Army Medical Research Institute of Chemical Defense, Aberdeen Proving Ground, MD, USA. cameron.good@northwestern.edu., Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Chemistry, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu. |
